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Paste your title, abstract or keywords. The finder matches them to research topics and suggests ranked journals that publish most on those topics.
Journals for “Electronic Packaging and Soldering Technologies”
Suggested journals
Topic match is relative to the best match in this search (100% = best). Under each journal, "Publishes on" shows which of the matched topics it publishes and what share of its recent papers they make up. Fees are shown only where DOAJ records them; "Not recorded" does not mean the journal is free.
| # | Journal | Topic match | ITS Journal Score | Global rank | Papers 2021–2025 | Open access | Fee (APC) | Compare |
|---|---|---|---|---|---|---|---|---|
| 1 | Soldering and Surface Mount Technology Emerald Publishing Limited · United Kingdom Publishes on: Electronic Packaging and Soldering Technologies (84%) | 100% | 64.6 | #10,014 | 158 | 4% | Not recorded | |
| 2 | Journal of Electronic Packaging ASM International · United States Publishes on: Electronic Packaging and Soldering Technologies (38%) | 45% | 68.5 | #7,696 | 278 | 15% | Not recorded | |
| 3 | IEEE Transactions on Components Packaging and Manufacturing Technology Institute of Electrical and Electronics Engineers · United States Publishes on: Electronic Packaging and Soldering Technologies (27%) | 32% | 74.4 | #4,406 | 1,657 | 24% | Not recorded | |
| 4 | Microelectronics Reliability Elsevier BV · United Kingdom Publishes on: Electronic Packaging and Soldering Technologies (23%) | 27% | 76.2 | #3,591 | 1,544 | 22% | Not recorded | |
| 5 | SMTA International Surface Mount Technology Association Publishes on: Electronic Packaging and Soldering Technologies (38%) | 45% | 31.0 | #39,173 | 436 | 0% | Not recorded | |
| 6 | Journal of Microelectronics and Electronic Packaging United States Publishes on: Electronic Packaging and Soldering Technologies (29%) | 34% | 50.8 | #18,925 | 77 | 100% | Not recorded | |
| 7 | Transactions of The Japan Institute of Electronics Packaging Japan Publishes on: Electronic Packaging and Soldering Technologies (30%) | 35% | 39.8 | #28,651 | 50 | 100% | Not recorded | |
| 8 | Journal of Electronic Materials Springer Science+Business Media · Switzerland Publishes on: Electronic Packaging and Soldering Technologies (11%) | 13% | 79.7 | #2,253 | 3,979 | 9% | Not recorded | |
| 9 | Journal of Engineering Research and Reports Sciencedomain International · India Publishes on: Electronic Packaging and Soldering Technologies (14%) | 16% | 63.9 | #10,432 | 1,344 | 100% | Not recorded | |
| 10 | On-Demand Webinars Publishes on: Electronic Packaging and Soldering Technologies (38%) | 45% | 9.1 | #60,761 | 133 | 0% | Not recorded | |
| 11 | IEEE Transactions on Device and Materials Reliability Institute of Electrical and Electronics Engineers · United States Publishes on: Electronic Packaging and Soldering Technologies (9%) | 10% | 70.9 | #6,267 | 578 | 28% | Not recorded | |
| 12 | Microelectronics International Emerald Publishing Limited · United Kingdom Publishes on: Electronic Packaging and Soldering Technologies (20%) | 24% | 44.3 | #24,123 | 119 | 7% | Not recorded | |
| 13 | Journal of Welding and Joining The Korean Welding and Joining Society · South Korea Publishes on: Electronic Packaging and Soldering Technologies (11%) | 14% | 56.6 | #15,100 | 323 | 100% | Not recorded | |
| 14 | Journal of The Japan Institute of Electronics Packaging Japan Institute of Electronics Packaging · Japan Publishes on: Electronic Packaging and Soldering Technologies (18%) | 21% | 38.1 | #30,445 | 806 | 7% | Not recorded | |
| 15 | Journal of Smart Processing Sumart Processing Society for Materials, Environment and Energy · Japan Publishes on: Electronic Packaging and Soldering Technologies (16%) | 20% | 32.4 | #37,305 | 233 | 100% | Not recorded | |
| 16 | Wafer-Level Packaging Symposium Surface Mount Technology Association Publishes on: Electronic Packaging and Soldering Technologies (22%) | 27% | 17.0 | #55,669 | 80 | 0% | Not recorded | |
| 17 | Jurnal Teknologi Muhammadiyah University of Jakarta · Malaysia Publishes on: Electronic Packaging and Soldering Technologies (2%) | 2% | 57.9 | #14,226 | 595 | 100% | Not recorded | |
| 18 | QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY Japan Welding Society · Japan Publishes on: Electronic Packaging and Soldering Technologies (3%) | 3% | 49.6 | #19,799 | 191 | 100% | Not recorded | |
| 19 | Journal of The Surface Finishing Society of Japan The Surface Finishing Society of Japan · Japan Publishes on: Electronic Packaging and Soldering Technologies (3%) | 4% | 42.5 | #25,826 | 538 | 100% | Not recorded | |
| 20 | Cherkasy University Bulletin: Physical and Mathematical Sciences The Bohdan Khmelnytsky National University of Cherkasy · DOAJ Publishes on: Electronic Packaging and Soldering Technologies (12%) | 14% | 12.4 | #59,172 | 57 | 100% | US$20 |
Before you submit
Use this list as a shortlist, not a decision. For each journal, read its aims and scope and a few recent articles, check its peer-review and fee policy on its own website, and confirm any indexing (Scopus, Web of Science, PubMed) with the indexer itself. Be careful with journals that promise very fast acceptance or that contact you by email asking for papers.
How the ITS Journal Score works
One formula applies to every ranked journal, using open data from OpenAlex: 45% citation impact, 35% h-index and 20% size (papers published 2021–2025). Citation impact is the smaller of the journal's two-year mean citedness and its five-year citations per paper, so a journal whose output collapsed cannot jump to the top on old citations. Each part is half a percentile and half a log-scaled value, so the very top is still separated. Growth and open-access share are shown separately and are not part of the score.
A journal is ranked only if it published at least 50 papers in 2021–2025 and was active in at least five of the last six years. Field rankings compare a journal only with journals in the same field; the field is the OpenAlex field with most of the journal's recent papers, or "Multidisciplinary" when no field has 30% of them.
What this is not: the ITS Journal Score is not a Journal Impact Factor, CiteScore or SJR, and this site does not say whether a journal is indexed in Scopus, Web of Science or PubMed. Always confirm aims and scope, indexing, peer review and fees on the journal's own website before you submit.