Overview
Journal of The Japan Institute of Electronics Packaging, published by Japan Institute of Electronics Packaging (Japan), published 806 papers in 2021–2025, and these papers have received 118 citations so far. Its h-index is 15 and its two-year mean citedness is 0.05. On the ITS Journal Score it ranks #30,445 of 62,158 ranked journals and #2,715 of 4,282 in Engineering.
Key figures
Citations are those received so far by the papers published in these years, so the most recent years have had less time to collect them. Two-year mean citedness is OpenAlex's measure of how often recent papers are cited; it is similar in idea to, but not the same as, an impact factor. Citation impact trend compares how often a journal's 2024-25 papers are cited with how often its 2021-22 papers were cited, each measured against all ranked journals' papers of the same years, so newer papers are not at a disadvantage. "Not enough papers" or "Not enough data" means fewer than 50 papers in one of the two-year periods (or fewer than 50 citations to the earlier papers). Values above +300% or below -90% are shown as "+300% or more" or "-90% or less": such extreme values come from very low citation counts for the earlier papers.
Papers and citations by year
| Year | Papers | Citations so far to that year's papers | Open-access papers |
|---|---|---|---|
| 2020 | 197 | 60 | 186 |
| 2021 | 164 | 34 | 34 |
| 2022 | 171 | 39 | 22 |
| 2023 | 159 | 25 | 0 |
| 2024 | 155 | 16 | 0 |
| 2025 | 157 | 4 | 1 |
What it publishes
The leading research topics of its papers (OpenAlex topic classification). Select a topic to find other journals that publish on it.
Similar journals
Ranked journals that publish on the same topics.
| Journal | Field | Score | Papers 2021–2025 | Open access |
|---|---|---|---|---|
| Soldering and Surface Mount Technology | Engineering | 64.6 | 158 | 4% |
| IEEE Transactions on Components Packaging and Manufacturing Technology | Engineering | 74.4 | 1,657 | 24% |
| Journal of Microelectronics and Electronic Packaging | Engineering | 50.8 | 77 | 100% |
| Journal of Electronic Packaging | Engineering | 68.5 | 278 | 15% |
| Transactions of The Japan Institute of Electronics Packaging | Engineering | 39.8 | 50 | 100% |
| Materials Science and Engineering R Reports | Engineering | 90.5 | 403 | 26% |
| SMTA International | Engineering | 31.0 | 436 | 0% |
| Disease-a-Month | Economics, Econometrics and Finance | 65.2 | 471 | 9% |
Compare with similar journals (side by side with the two closest journals above)
Identity and sources
- ISSN-L: 1343-9677
- Print ISSN: 1343-9677
- Electronic ISSN: 1884-121X
- Publisher: Japan Institute of Electronics Packaging
- Listed in DOAJ: No
- Crossref: ISSN found in Crossref
- OpenAlex: S66058762
Figures come from OpenAlex (papers, citations, h-index, topics), Crossref (ISSN check) and DOAJ (open-access listing and fees). They change as records are corrected, so treat them as a dated snapshot. This page does not state whether the journal is indexed in Scopus, Web of Science or PubMed.
Questions
What is the ITS Journal Score of Journal of The Japan Institute of Electronics Packaging?
It is 38.1 out of 100, which places it #30,445 among ranked journals. The score combines citation impact (45%), h-index (35%) and size (20%) from open OpenAlex data.
What is the impact factor of Journal of The Japan Institute of Electronics Packaging?
This site does not publish Journal Impact Factors, which belong to Clarivate. As an open alternative, its two-year mean citedness in OpenAlex is 0.05.
Is Journal of The Japan Institute of Electronics Packaging open access?
7% of its papers from 2021–2025 are recorded as open access.
Does Journal of The Japan Institute of Electronics Packaging charge a publication fee?
The fee is not recorded in our data. This does not mean the journal is free. Check the journal's own website for its current fees.